Name: Etching
Availability: InStock

Course Overview

Etching is a cornerstone of modern microfabrication, where precision and control in material removal are essential for creating today's advanced technologies. From microchips to MEMS devices, this critical process transforms designs into the functional components that power our everyday electronic devices.

In this course, you will examine both fundamental and advanced etching techniques essential for semiconductor processing. You'll begin by exploring wet and dry etching fundamentals, including isotropic vs. anisotropic etching and chemical vs. physical mechanisms. Through interactive activities, projects, and demonstrations in Cornell's NanoScale Facility cleanroom, you'll evaluate etching techniques and their applications, determining how to select the best processes for specific manufacturing requirements.

You will then advance to cutting-edge techniques, including reactive ion etching (RIE), deep reactive ion etching (Deep RIE), and atomic layer etching (ALE) while examining precision monitoring tools like optical emission spectroscopy and ellipsometry. By the end of this course, you will have a strong foundation in both the practical and theoretical aspects of semiconductor etching processes.

Key Course Takeaways

Differentiate wet and dry etching techniques, evaluating process parameters to choose appropriate approaches for microelectronic device manufacturing
Examine plasma etching mechanisms and RIE operation to understand how they enable precise material removal in modern semiconductor manufacturing
Evaluate how process parameters affect etching outcomes to determine appropriate approaches for specific manufacturing requirements
Analyze advanced etching techniques and their applications in next-generation device manufacturing

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How It Works

Course Length

2 weeks

Effort

8 to 10 hours of study per week

Format

100% online, instructor-led

Course Author

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Jeremy Clark

Senior Plasma Process Engineer

Cornell NanoScale Facility

Senior Plasma Process Engineer, Cornell NanoScale Science Facility

Jeremy Clark is a Senior Plasma Process Engineer at the Cornell NanoScale Science and Technology Facility (CNF). His work focuses on advancing micro- and nano-scale fabrication techniques, particularly in plasma processing, thin film deposition, and both wet and dry etching methodologies. Prior to CNF, Mr. Clark served as a Research Process Engineer at Corning Incorporated, specializing in thin film development and equipment modification. He also worked as a Research Assistant at NanoPower Research Library, focusing on quantum dot solar cell fabrication and characterization.

In his current role, Mr. Clark oversees an array of semiconductor processing equipment, which involves training users, developing new processes, and maintaining the equipment’s availability. He contributes significantly to CNF’s research initiatives through his expertise in device fabrication, CAD layout, and material characterization.

A graduate of Rochester Institute of Technology, Mr. Clark holds a B.S. in Microelectronics with specialized focus in MEMS and Nanomaterials, combining academic training with 20 years of hands-on experience advancing the field of nanofabrication.

Who Should Enroll

Process engineers and technicians looking to specialize in wet and dry etching modules
MEMS and microfluidics designers needing to understand deep reactive ion etching and material removal limitations
Semiconductor manufacturing professionals seeking to upskill in advanced techniques like atomic layer etching
Device engineers responsible for integrating etching steps into broader process flows
Equipment sales and support staff representing etching tool vendors (e.g., plasma or wet bench systems)
Fabrication managers overseeing yield improvement and defect reduction in etching sectors
Professionals transitioning from general manufacturing into the semiconductor or nanotechnology industries
Researchers and graduate students requiring practical knowledge of cleanroom etching protocols

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